ABOUT
Dr. Himani Sharma received her Ph.D. degree in Chemistry (2006) from University of Delhi, India. She worked as a Research Associate in Electrical Engineering department in Alabama A&M University on NSA-funded project, before joining Georgia Institute of Technology as postdoc in Packaging Research Center in 2008. She was later promoted to a Research Scientist-II position as she continued her materials research. In her role as a Technical Leader for 3D-IPAC (Integrated passive and active component program) in PRC, she developed and drove technologies in partnership with companies in consumer and medical electronics. Her research focused on developing materials for next-generation passive components and susbrates.
She has authored more than 60 publications in international peer-reviewed journals and conferences. She has co-authored 1 book, 3 book chapters and 1 pending patent. Dr. Sharma transitioned to teaching undergraduates in School of Material Science and Engineering (MSE) at GaTech in July 2019. She is currently responsible for junior and senior laboratory courses in MSE.
PUBLICATIONS & PATENTS
BOOKS CHAPTERS AUTHORED
- Fundamentals of Microelectronic Systems Packaging (2018)
- Chapter Title: “Micro and Nanopackaging materials”
- Authors: Himani Sharma, P. M. Raj, C P Wong, R. Das; Editor: Tummala, R. R
- Publishers: McGraw Hill Publications
- Materials for Advanced Packaging (2017)
- Chapter Title: “Embedded Passives”
Authors: Himani Sharma, P. M. Raj, D. W. Lee, L. Li, S. X. Wang, P. Chakraborti, S. Jain, and R.
Tummala
- Publishers: Springer International Publishing, 2017, pp. 537-588
- Nanopackaging: From Nanomaterials to the Atomic Scale (2015)
Chapter Title: “Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with
Passive Components”
- Authors: P.M. Raj, P. Chakaroborti, D. Mishra, Himani Sharma, SK Sitaraman, R .Tummala
- Publishers: Springer International
- NANOMAGNETISM (2014)
- Chapter Title: “Nanomagnetic Structures, Properties and Applications In integrated RF and Power Modules and Sub-systems
- Authors: P. Markondeya Raj, Dibyajat Mishra, Erik Shipton, Himani Sharma and Rao Tummala
- Publishers: One Central Press UK
- Editors: Julina Gonzalez
- Nanoelectronic Device Applications Handbook (2014)
Chapter Title: “Package-Compatible High Density Nano-Scale Capacitors with Conformal Nano-
Dielectrics”
- Authors: Himani Sharma, P. M. Raj, P. Chakarborti, R. Tummala
- Publishers: CRC Press (Taylor & Francis Group.)
- Editors: James Morris & Krzysztof Iniewski
- Book Title: Synthesis, Properties and Surface Modifications of CdSe Quantum Dots (2010)
- ISBN # 978-3-8433-6362-4
- Authors: Himani Sharma, Shailesh N. Sharma and S.M. Shivaprasad
PUBLISHED JOURNAL & CONFERENCE PAPERS
* Citations: 500+ (Google Scholar)
Journal publications: 40+ peer-reviewed journals
Conference paper: 20+ presentations and articles
* Publication list available at Himani Sharma’s profile in Google Scholar
EDUCATION & AWARDS
- Ph.D., Chemistry - July 2007 - University of Delhi and National Physical Laboratory, New Delhi, India. Dissertation: Synthesis, Properties and Surface Modifications of Organically capped CdSe Quantum Dots
- MS, Physical Chemistry - May 2002 - University of Delhi, New Delhi, India
- BS, Chemistry - May 2000 - Dyal Singh College, University of Delhi, New Delhi, India
Won 2018-19 Research Faculty Teaching Fellowship (RFTF) Award at GaTech
- Taught course in School of MSE @ GT
IEEE-ECTC 2011 Best Poster Award for paper entitled, “Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers” in ECTC conference, May-June 2011 Orlando, FL
CPMT 2011 ECTC Travel Award for paper titled, “Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon” in ECTC 2011
Patent Issued: Title: Systems and Methods for Fabricating High-Density Capacitors US Application Number: No. 12/435,971
Served as reviewer for several high-impact journals
- Superlattices and Microstructures
- Journal of Materials Science: Materials in Electronics
- Nanotechnology
- Semiconductor Science and Technology
RESEARCH INTERESTS
RESEARCH EXPERIENCE
Research Scientist- II (Sept 2012- Current)
Packaging Research Center
Georgia Institute of Technology, Atlanta, GA
Technical leader of the 3D Integrated Passive and Active Components (3D IPAC) Program
- Lead material research in interposers and packages
- Explore, develop and drive technologies in partnership with semiconductor and medical industry for manufacturing needs
- Introduce newly developed technologies to commercialization for high volume manufacturing at low cost designs, materials, processes and tools
Postdoctoral Fellow (Sept’ 2008- Aug 2012)
Packaging Research Center
Georgia Institute of Technology, Atlanta, GA Principal Investigator: Prof. Rao Tummala
Research focus
- Develop passive component technologies focused on improved properties, miniaturization and cost compared to discrete components for digital, RF and medical applications
- Synthesize and process nanocomposite and thin film functional materials for capacitors, inductors, antennas and EMI isolation
Research Associate (Sept’ 07 – Jul’ 08)
Alabama A&M University, Huntsville, AL
Principal Investigator: Dr. Zhigang Xiao
Worked on National Security Agency (NSA) supported project directed at fabricating transistors based on carbon nanotubes. The project aimed at better understanding the science of single walled carbon nanotube based devices.
- Configuring CNT network of arrays by Dielectrophoresis
- Fabrication of CNT based field-effect transistors and circuits
Senior Research Fellow National Physical Laboratory University of Delhi, Delhi, India (2002 – 2006)
- Synthesis, Properties and Applications of semiconductor quantum dots
- Electrochemical Growth and Characterizations of novel Semiconductor Nanofilms with efficient Photovoltaic applications